薄膜物理淀积技术培训课程(PPT 54页)

第九章：薄膜物理淀积技术
Metal Layers in a Chip
Multilevel Metallization on a ULSI Wafer
Copper Metallization
Simple Evaporator
RF Sputtering System
Silicon and Select Wafer Fab Metals (at 20°C)
Junction Spiking
Formation of Self-Aligned Metal Silicide (Salicide)
Chip Performance Issues Related to a Salicide Structure

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