BGA封装工艺简介(PPT 55页)

BGA  Package Structure
Typical  Assembly Process Flow
FOL– Front of Line前段工艺
FOL– Front of Line   Wafer
FOL– Back Grinding背面减薄
FOL– Wafer Saw晶圆切割
FOL– Optical Inspection
FOL– Die Attach 芯片粘接
FOL– Epoxy Cure 银浆固化，检验
FOL– Wire Bonding 引线焊接
FOL–Optical Inspection 检查
正常品
Material Problem
1st Bond Fail ( I )
1st Bond Fail (II)
1st Bond Fail ( III )
1st Bond Fail (IV)
1st Bond Fail (V)
Bonding Weld Inspection
 2nd Bond Fail ( II )
 Looping Fail(Wire Short I)
Looping Fail(Wire Short II)
Looping Fail(Wire Short III)
EOL– End of Line后段工艺
EOL– Molding（注塑）
  EOL– Molding（注塑）
EOL– Post Mold Cure（模后固化）
EOL– Laser Mark（激光打字）
EOL– Ball Attach  植球
Ball REFLOW 参数
EOL– Singulation
EOL– Singulation
EOL– Test  测试
EOL– Final Visual Inspection（终检）
EOL– Packing 包装
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