SMT设备原理与应用(PPT 42页)

SMT概述与发展趋势4学时
summaryandtrend
焊膏组成与印刷的方式4学时
solderpastecompositionandprintingtechnology
印刷机原理与应用6学时
principleandapplicationofprinter
贴片机原理与设备12学时
principleandapplicationofplacementmachines
波峰焊原理与应用6学时
principleandapplicationofwavesolderingoven
再流炉原理与应用6学时
principleandapplicationofreflowsolderingoven
检测设备  4学时
inspectionequipment
SMT设备原理与应用PrincipleandApplicationofSMTEquipment
SMT设备概述Summarize
本课程的主要内容Including
实验内容experimentcontent
考试方式testrules
辅导时间和联系方式
SMT概述与发展趋势
SMT技术发展历史和优点Historyandbenefits
常用术语Terms
Typesofsurfacemountassemblytechnology
Surfacemountsolderingprocess
AdvantagesofsolderpastetechnologyinSMT
技术发展趋势
Technologydrivingforce
Speed
Complexity
Miniaturization
Areaarraypackages
ballgridarray(BGA)
chipscalepackages(CSP)
Flipchip

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