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世界半导体生产机台安全设计验收标准英文版(doc 111)

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世界,半导体生产,安全设计,验收标准,英文版

世界半导体生产机台安全设计验收标准英文版(doc 111)内容简介

Section 1.0 MANAGEMENT SUMMARY(管理摘要)
Section 2.0 SCOPE(范围)
Section 3.0 SYSTEM DESCRIPTION(系统描述)
Section 4.0 ASSESSMENT & TESTING METHODOLOGIES(试验方法)
Section 5.0 SAFETY ASSESSMENT(安全评估)
5.1 PURPOSE(目的)
5.2 SCOPE(适用范围)
5.3 SAFETY PHILOSOPHY(安全体系)
5.4 GENERAL GUIDELINES(指导方针)
5.5 SAFETY-RELATED INTERLOCKS(安全互锁)
5.6 CHEMICALS(化学品)
5.7 IONIZING RADIATION
5.8 NON-IONIZING RADIATION
5.9 NOISE(噪音)
5.10 VENTILATION AND EXHAUST(通风与排凤)
5.11 ELECTRICAL
5.12 EMERGENCY SHUTDOWN(紧急停机)
5.13 HEATED CHEMICAL BATHS
5.14 HUMAN FACTORS ENGINEERING
5.15 ROBOTIC AUTOMATION
5.16 HAZARD WARNING(危险警告)
5.17 EARTHQUAKE PROTECTION(地震警告)
5.18 DOCUMENTATION(文件)
5.19 FIRE PROTECTION(消防保护)
5.20 ENVIRONMENTAL GUIDELINES(环境方针)
Section 6.0  RECOMMENDATIONS
Section 7.0 - ILLUSTRATIONS
ILLUSTRATION 1 - Mirra Trak System Layout
ATTACHMENT ONE - SURFACE LEAKAGE CURRENT TEST(泄漏测试)
ATTACHMENT TWO - GROUNDING RESISTANCE TEST (接地电阻测试)
ATTACHMENT THREE - VERIFICATION OF EMO(紧急按钮确认)
ATTACHMENT FOUR - SOUND PRESSURE LEVEL SURVEY(声压测试)
ATTACHMENT FIVE - ERGONOMIC CHECKLIST(人体功力检查表)
ATTACHMENT SIX - MANUAL HANDLING LIFT ANALYSIS(手动操作分析)
ATTACHMENT SEVEN - 揥HAT-IF?” HAZARD ANALYSIS(危险分析)
ATTACHMENT EIGHT - SEMI S10-1296 RISK ASSESSMENT GUIDELINE METHODOLOGY
CONCLUSION


A follow-up safety assessment of the ApplIEd Materials’ Chemical Mechanical Polishing System, Model: Mirra Trak (hereafter referred to as the Mirra Trak), was performed from February 2, 1998 through February 4, 1998. A further re-inspection of the system was performed on June 3, 1998. A preliminary evaluation of the system was also performed on September 25, 1996 through September 26, 1996, and the results of this evaluation were also utilized in this report. Note that this report covers only the concerns raised by integrating tHRee separate systems, the ApplIEd Materials FABS and Mirra CMP, and the OnTrak Synergy Integra, which together form the Mirra Trak system. For further information concerning the individual components, reference the individual SEMI S2-93A reports for these unITs. (GS3 Report No. 970668TF, dated January 30, 1998 for the FABS system; GS3 Report No. 7-0100, dated September 2, 1997 for the Mirra CMP


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世界半导体生产机台安全设计验收标准英文版(doc 111)简介结束